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Semiconductor manufacturers are searching for materials to enhance production processes. Current solutions have time-consuming process change over, cause a high scrap rate through damage to the parts, and leave residue. Setex materials can be finely tuned to the shear and peel strength that the part handling operation requires, be easily removed without damage to even the thinnest and most delicate wafers, leave no residue, and can withstand the environmental conditions of wafer manufacturing and processing.
Chip Handling and Transfer Tape
Clean storage, shipping, and handling are critical steps in the semiconductor industry. Conventional materials can leave residue on the chips. Setex materials can provide a clean and easily removable bond, providing new innovations in semiconductor processing and packaging.
THE TECH
Wafer Handling
THE TECH
Pick and Place
THE TECH
Setex dry adhesive consists of arrays of microfibers that can repeatedly bond to smooth surfaces. The fibers’ tips are flat to achieve maximum surface contact and are on the micron-scale so they can be used to manipulate even the smallest components.
This technology enables the picking and placing of even the most delicate parts without leaving residue for thousands of cycles.
Performance over 1,000 Peel Cycles